回流焊工藝中英文對照

來(lái)源: 安徽廣晟德 人氣:2045 發(fā)表時(shí)間:2021/05/24 15:28:05
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目前比較多的大型電子生產(chǎn)企業(yè)所用的回流焊還是以進(jìn)口回流焊設備為主。進(jìn)口回流焊設備所有操作說(shuō)明和工藝說(shuō)明都是以英文說(shuō)明書(shū)為主,這樣就給許多不懂英文的回流焊操作技術(shù)員造成了困擾。廣晟德在這里就給大家分享一下常用的回流焊工藝英文說(shuō)明書(shū)翻譯對照。

L8八溫區回流焊機.jpg


1. Fundamentals of Solders and Soldering(焊料及焊接基礎知識)

Soldering Theory(焊接理論)

Microstructure and Soldering(顯微結構及焊接)

Effect of Elemental Constituents on Wetting(焊料成分對潤濕的影響)

Effect of Impurities on Soldering(雜質(zhì)對焊接的影響)


2. Solder Paste Technology(焊膏工藝)

Solder Powder ( 錫粉)

Solder Paste Rheology(錫膏流變學(xué))

Solder Paste Composition & Manufacturing(錫膏成分和制造)


3. SMT Problems Occurred Prior to Reflow(回流前SMT問(wèn)題)

Flux Separation(助焊劑分離)

Paste Hardening(焊膏硬化)

Poor Stencil Life(網(wǎng)板壽命問(wèn)題)

Poor Print Thickness(印刷厚度不理想)

Poor Paste Release From Squeegee(錫膏脫離刮刀問(wèn)題)

Smear(印錫模糊)

Insufficiency(印錫不足)

Needle Clogging(針孔堵塞)

Slump(塌落)

Low Tack(低粘性)

Short Tack Time (粘性時(shí)間短)


4. SMT Problems Occurred During Reflow(回流過(guò)程中的SMT問(wèn)題)

Cold Joints(冷焊)

Nonwetting(不潤濕)

Dewetting(反潤濕)

Leaching(浸析)

Intermetallics(金屬互化物)

Tombstoning(立碑)

Skewing(歪斜)

Wicking(焊料上吸)

Bridging(橋連)

Voiding(空洞)

Opening(開(kāi)路)

Solder Balling(錫球)

Solder Beading(錫珠)

Spattering(飛濺)


5. SMT Problems Occurred at Post Reflow Stage(回流后問(wèn)題)

White Residue(白色殘留物)

Charred Residue(炭化殘留物)

Poor Probing Contact(探針測接問(wèn)題)

Surface Insulation Resistance or Electrochemical Migration Failure

(表面絕緣阻抗或電化遷移缺陷)

Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants

(分層 / 空洞 / 敷形涂覆或包封的固化問(wèn)題)


6. Challenges at BGA and CSP Assembly and Rework Stage

(BGA、CSP組裝和翻修的挑戰)

Starved Solder Joint(少錫焊點(diǎn))

Poor Self-Alignment(自對位問(wèn)題)

Poor Wetting(潤濕不良)

Voiding(空洞)

Bridging(橋連)

Uneven Joint Height(焊點(diǎn)高度不均)

Open(開(kāi)路)

Popcorn and Delamination(爆米花和分層)

Solder Webbing(錫網(wǎng))

Solder Balling(錫球)


7. Problems Occurred at Flip Chip Reflow Attachment

(倒裝晶片回流期間發(fā)生的問(wèn)題)

Misalignment(位置不準)

Poor Wetting(潤濕不良)

Solder Voiding(空洞)

Underfill Voiding(底部填充空洞)

Bridging(橋連)

Open(開(kāi)路)

Underfill Crack(底部填充裂縫)

Delamination(分層)

Filler Segregation(填充分離)

Insufficient Underfilling(底部填充不充分)


8. Optimizing Reflow Profile via Defect Mechanisms Analysis

(回流曲線(xiàn)優(yōu)化與缺陷機理分析)

Flux Reaction(助焊劑反應)

Peak Temperature(峰值溫度)

Cooling Stage(冷卻階段)

Heating Stage(加熱階段)

Timing Considerations(時(shí)間研究)

Optimization of Profile(曲線(xiàn)優(yōu)化)

Comparison with Conventional Profiles(與傳統曲線(xiàn)的比較)

Discussion(討論)

Implementing Linear Ramp Up Profile(斜坡式曲線(xiàn))


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